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According to different applications, different dimensions, heat dissipation schemes and luminous effects | #led

According to different applications, different dimensions, heat dissipation schemes and luminous effects
Science and Technology

According to different applications, different dimensions, heat dissipation schemes and luminous effects

The LED packaging forms are divided into seven paragraphs: pin type, power type packaging, surface mount type (SMD), chip-on-board (COB), Chip-LED, UVC metal, and ceramic packaging.
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