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According to different applications, different dimensions, heat dissipation schemes and luminous effects | #led

According to different applications, different dimensions, heat dissipation schemes and luminous effects
Znanost i tehnologija

According to different applications, different dimensions, heat dissipation schemes and luminous effects

The LED packaging forms are divided into seven paragraphs: pin type, power type packaging, surface mount type (SMD), chip-on-board (COB), Chip-LED, UVC metal, and ceramic packaging.
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